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中文摘要：
分别在（80±1）℃和（50±1）℃条件下研究紫铜及其沉积NaCl盐后的腐蚀行为,揭示了中高温条件下温度对电子产品中铜腐蚀的影响规律,通过失重法、Olympus BX51M显微镜、X射线衍射等手段进行表征.结果表明,紫铜单位面积失重量随暴露时间的延长而增加,但其腐蚀速率随时间的延长而逐渐减小,最后趋于平缓.随着环境温度的升高,紫铜的腐蚀速率会增大.经盐沉积后的紫铜,其腐蚀速率大于洁净的紫铜,说明氯离子加剧了紫铜的腐蚀.经盐沉积后的紫铜在盐粒沉积区开始发生腐蚀,随着时间的延长扩展到其临近区域.对腐蚀产物结构的测定表明,紫铜暴露在大气中其腐蚀产物主要是由氧化亚铜组成,而沉积盐后的紫铜其腐蚀产物主要是由氧化亚铜、碱式氯化铜组成,故腐蚀更严重.
英文摘要：
The corrosion behavior of red copper using in electronic products are studied in the medium-high temperature. At （80 ± 1）℃ and （50±1）℃, the corrosion behavior of red copper and its surface deposited with sodium chloride salt are investigated by weight loss, Olympus BX51M microscope analysis and XRD. The results show that the weightless quantity increases with prolonged exposure time, but the corrosion rate gradually decreases with prolonged time, finally flattening. With the increase of environmental temperature, the corrosion rate of red copper is greater. The corrosion rate of copper deposited with salt is greater than that of the clean red copper. The presence of chloride ions exacerbates the corrosion of copper. And the corrosion initiates along the deposition area of salt particles on the surface of the red copper deposited with salt, then it extendes to other regions. The corrosion products of the copper exposed to the atmospheric is mainly composed of cuprous oxide, while corrosion products of copper deposited with salt mainly by the cuprous oxide, basic copper chloride, thus corrupting copper deposited with salt even more serious.
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