中文摘要：

讨论多板材单一圆片剪冲下料问题,即使用剪冲工艺将若干种不同尺寸的板材剪冲出一定数量的单一尺寸圆片,优化目标是使得材料利用率尽可能的高。文中采用由圆片条带组成的规范多级排样方式,简化剪切工艺;采用多板材组合下料方案,提高下料利用率。首先运用动态规划算法确定圆片在每种板材中的排样方式;然后运用整数规划算法确定多板材组合下料方案。计算结果表明,对于板材使用张数无约束问题和有约束问题,文中算法生成的下料方案比文献中算法生成的下料方案,下料利用率分别提高了1.75%和1.38%。

英文摘要：

It focuses on the problem of cutting and punching multiple plate into single wafer, namely using the cutting and punching craftwork to make several different sizes of sheet metal into a certain number of single wafer, and the optimization objective of the material utilization rate is as high as possible. It uses the wafer bands to constitute the normal multi-stage layout mode to simplify the shear process; uses multi sheet composite cutting stock scheme to improve the utilization rate of material. First applies the dynamic programming algorithm to determine the layout mode of wafer in each plate, then apples the integer programming algorithm to determine the multi plate combination The calculation results show that, for the plate number unconstrained problems and constrained problems, the material utilization of this scheme is higher about 1.75% and 1.38% than the literature＇s scheme.