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中文摘要：
微纳加工技术推动着集成电路不断缩小器件尺寸和提高集成度，光学光刻技术依然是目前的主流微纳加工技术，同时有多种替代技术如电子束直写、极紫外光刻和投影电子束技术，文章介绍了自上而下的微纳加工技术的进展及其在微纳器件研制的重要作用。
英文摘要：
Micro/nano fabrication is the dominant factor in increasing the number of components per chip and further shrinking the size of devices. Until now, optical lithography has been the mainstream technology for the integrated circuit industry. For dimensions smaller than 45nm it is still undecided what is the best exposure method. Options include electron beam direct writing and projection, and extreme ultraviolet （EUV） exposure. Recent progress in top-down nano-fabrication processes such as optical, electron beam and EUV lithography, and their applications in manufacturing nano-devices are reviewed.
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