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三维轴对称功能梯度圆板的稳态热传导分析
  • ISSN号：1005-9784
  • 期刊名称：中南大学学报（英文版）
  • 时间：0
  • 页码：-
  • 相关项目：功能梯度材料结构的热粘弹性分析
作者： 刘五祥|
同期刊论文项目
功能梯度材料结构的热粘弹性分析
期刊论文 8
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THREE-DIMENSIONAL THERMOELASTIC ANALYSIS OF FUNCTIONALLY GRADED PLATE
 ？Three-dimensional Analysis of Functionally Graded Piezoelectric Plate with Arbitrarily Di
具有任意梯度分布函数的梯度板的三维热弹性
Analysis of steady heat conduction for 3D axisymmetric functionally graded circular plate
任意梯度分布功能梯度板的二维热弹性振动分析
Three-dimensional Analysis of Functionally Graded Piezoelectric Plate with Arbitrarily Distributed Material Properties
Analysis of steady heat conduction for 3D axisymmetric functionally graded circular plate