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中文摘要：
采用Ti活性中间层对ZrC-20~SiC复合陶瓷进行扩散焊连接，研究了活性元素Ti与复合陶瓷的界面反应机理，分析了焊接温度对接头微观组织以及力学性能的影响。结果表明：Ti与复合陶瓷发生界面反应，首先形成TiC化合物层，部分反应中间产物zr原子固溶于TiC化合物中，其余部分扩散进入Ti中间层，形成固溶体；延长反应时间或提高焊接温度，Ti进一步与反应中间产物Zr、Si原子在靠近陶瓷一侧生成Ti-zrsi三元相，同时增加界面反应层的厚度。焊接接头的剪切强度随温度由900℃升高到1200℃先提高后降低，在压力为20MPa及1000℃保温30min条件下，达到最大值（149MPa）。
英文摘要：
ZrC-20%SiC composite ceramic （ZS） was bonded with a pure Ti interlayer. The typical microstructure and interra- cial reaction mechanism of the ZS/Ti/ZS joint were analyzed. The effect of bonding temperature on the interfacial microstruc- ture and mechanical property was investigated. The results show that the TiC compound is formed at the interface due to the interaction between Ti and ZrC-SiC composite. The atoms of Zr and Si release as the intermediate products. A portion of Zr at- oms are diffused into the TiC layer and the remains are diffused into the Ti interlayer as solid solution atoms. The Ti-Zr-Si phase is formed nearby the ZtC-SiC composite at a higher bonding temperature or a longer bonding tim~ The thickness of the formed reaction layer increases. The shear strength of the diffusion bonded joints firstly increases and then decreases when the bonding temperature in- creases from 900 ℃ to 1 200 ℃. The maximal value is 149 MPa when bonded at 1 000 ℃ under 20 MPa for a0 mln
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