中文摘要：

无铅的 Sn3.5Ag 和 Sn3.5Ag0.5Cu 焊接球被激光回流到形式焊接肿块。砍测试在solder 肿块上被执行，并且 SEM/EDX (扫描电子显微镜学/精力散X光检查分光计)被用来有限元素在接口在温度坡度和分发上当模特儿在接口 region.A 分析金属间化合的混合物( IMC )的形成在激光期间焊接肿块回流过程被进行阐明 IMC 生长方向的机制。结果证明为激光的参数窗口回流 Sn3.5Ag0.5Cu 颠簸比 Sn3.5Ag.The 的宽砍 Sn3.5Ag0.5Cu 的力量焊接肿块比得上 Sn3.5Ag 的焊接肿块，并且没被适当参数被使用的激光力量和照耀时间显然影响。激光力量和加热时间在 IMCs.A 连续 AuSn4 金属间化合的复合的层的形成上有重要效果，一些像针的 AuSn4 在接口被观察焊接并且 Au/Ni/Cu 敷金属法层当激光力量是小的时。像针的 AuSn4 的形成由于在接口的温度坡度，并且温度坡度的方向是增加激光力量并且加热时间的 AuSn4.With 的比较喜欢的生长方向，溶解进体积的像针的 AuSn4 IMC 焊接，并且沿着solder 肿块的谷物边界在团结期间再次外面猛抛。

英文摘要：

ead-free Sn3.5Ag and Sn3.5Ag0.5Cu solder balls were reflowed by laser to form solder bumps. Shear test was performed on the solder bumps, and SEM/EDX （scanning electron microscopy/energy dispersive X-ray spectrometer） was used to analyze the formation of intermetallic compounds （IMCs） at interface region. A finite element modeling on the temperature gradient and distribution at the interface of solder bump during laser reflow process was conducted to elucidate the mechanism of the IMCs growth direction. The results show that the parameters window for laser reflow bumping of Sn3.5Ag0.5Cu was wider than that of Sn3.5Ag. The shear strength of Sn3.5Ag0.5Cu solder bump was comparable to that of Sn3.5Ag solder bump, and was not affected obviously by laser power and irradiation time when appropriate parameters were used. Both laser power and heating time had a significant effect on the formation of IMCs. A continuous AuSn4 intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and Au/Ni/Cu metallization layer when the laser power is small. The formation of needle-like AuSn4 was due to temperature gradient at the interface, and the direction of temperature gradient was the preferred growth direction of AuSn4. With increasing the laser power and heating time, the needle-like AuSn4 IMCs dissolved into the bulk solder, and precipitated out once again during solidification along the grain boundary of the solder bump.