中文摘要：

随着2006年7月1日RoHS法令实施的最后期限的来临，无铅焊料的研究与应用又掀起了新一轮的热潮。由于封装材料与封装工艺的改变，给焊点可靠性带来了一系列相关问题。笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；对今后该领域的研究前号及方向进行了展望。

英文摘要：

As RoHS law will be implemented on July 1,2006, the research and application of lead-free solders become a hot problem in the world. With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability. Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed. The prospective research on directions of lead-free technology in the future are forecasted.