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Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste
  • ISSN号：1043-7398
  • 期刊名称：Journal of Electronic Packaging
  • 时间：2012.12.12
  • 页码：-
  • 相关项目：大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
作者： Yan, Yi|Chen, Xu|Liu, Xingsheng|Mei, Yunhui|Lu, Guo-Quan|
同期刊论文项目
大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
期刊论文 14 会议论文 5
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