描述一种应用于集成电路制造的超精密硅片台系统及其运动控制。介绍了超精密硅片台系统配置及其主从控制原理,结合粗动台和微动台两者的优点,可以实现运动控制的大行程和高精度。基于闭环控制,给出精密硅片台机电系统动力学辨识的方法并进行了实验辨识。利用环路整形技术,研究并联PID控制器和鲁棒控制器的自动综合方法。基于实际实现,提出力解耦控制策略。仿真结果表明,利用双台结构的超精密硅片台的定位精度可达到10nm。
Motion control system of an ultra precision wafer stage with application to integrated circuit production was presented. Configuration and master/slave control principle of ultra precision wafer stage were introduced. By adopting merits of both coarse and fine stage,a desired motion control system having the capacity of large workspace with high resolution of motion was enabled. Identification method of mechatronics system such as ultra precision wafer stage was pictured and done based on closed--loop control. The automated synthesis procedure of parallel PID controller and robust controller were developed using loop shaping techniques. Force decoupling strategy was developed under the consideration of reality in practice. The simulation result shows that the positioning precision achieves to 10 nanometers in the ultra precision wafer stage using dual stage.