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Electroless copper plating on PC engineering plastic with a novel palladium-free surface activation
  • ISSN号：0257-8972
  • 期刊名称：Surface and Coatings Technology
  • 时间：2014.7.25
  • 页码：69-73
  • 相关项目：缺陷诱导陶瓷粉体表面生长金属层与机理研究
作者： Ding, Xiao-Yu|Cheng, Ji-Gui|Zhu, Liu|Wu, Yu-Cheng|
同期刊论文项目
缺陷诱导陶瓷粉体表面生长金属层与机理研究
期刊论文 24 专利 2
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