中文摘要：

随着电子产品向小型化、高集成度的方向发展,电子产品的封装技术已逐步迈入到微电子封装时代。电子产业已成为当今世界最活跃、最重要的产业之一。回顾了电子封装的发展历程,着重介绍了当今一些被广泛应用的封装形式,讨论了电子封装领域的最新动态和发展趋势。最后,根据研究现状给出了发展我国微电子封装技术的建议。

英文摘要：

With the miniaturization and high integration of electronic products,electronics packaging technology has entered the era of microelectronics packaging.This paper reviews the development history of electronic packaging and several widely used packaging forms.In the end,some suggestion on the development of the microelectronics packaging technology is put forward.