描述了一种新的细胞电融合芯片的研究过程,分析芯片内微电极结构对电场大小、分布的影响。在前期细胞电融合芯片微电极研究的基础上,提出了更加适合于细胞电融合的电极阵列结构模型——梳状交叉微电极阵列,通过仿真计算和实际测试证明了该模型的有效性;通过对材料的优缺点进行分析,选择合适的芯片材料;硅基材料上的微电极及芯片加工工艺研究;微电极的抗氧化与抗腐蚀保护技术研究。最后,在新研制的细胞电融合芯片原型上进行了初步实验,取得了较好的实验效果。
The research and development of a novel cell-electrofusion chip is described in this paper. At first, the interrelation between the configuration of mieroelectrodes and the magnitude and distribution of electric field is analyzed in detail. According to this analysis and previous study, a pectinate and interdigital microeleetrode array is pro- posed, whose usability is validated by simulation and experimental studies. Secondly, suitable material is chosen through comparing different materials. Thirdly, the silicon substrate based fabricating techniques for the microelectrode and microchip is studied. Fourthly, anti-oxidizing and anti-eroding technology of the mieroelectrode is also studied. Finally, cell-electrofusion experiments were explored on this new chip and good fused effect was achieved.