中文摘要：

基于具体案例分析，介绍了超声波无损检测技术在半导体工艺中的应用。采用回声法和穿透法检测了封装体件内部塑封界面的裂纹、封装体底部填充胶的孔洞以及硅通孔的成型质量。通过声波成像原理和实例分析的比对结果表明，穿透法适合快速判断封装体是否发生失效，而回声法则适合逐层检测缺陷的位置。对于某些封装体内部深层次的缺陷，需要对比回声法和穿透法的整体成像来完成失效判断。对于某些半导体工艺的质量，需要运用回声法的时间记录模式来完成质量分析，其深度检测的误差可以控制在5％以内。

英文摘要：

Based on the actual failure analyses on package defects, the applications of ultrasonic inspection in advanced semiconductor technology were introduced. The inspection of package internal cracks, inspection of underfill voids in flip-chip packaging, and the evaluation of TSV （through silicon via） forming quality were achieved by using pulse echo and thru-transmission. It is concluded that the thru-transmission method is more suitable to make quick inspection for defects and the pulse echo method is more suitable to confirm the defect location. For some package internal defects under multiple interfaces, the defect location can only be found by using the combination method with C-scan and T- scan modes. For the quality of some semiconductor technologies, it needs the time flight mode in push echo method and the measurement difference can be controlled within 5%.