中文摘要：

用SB2230型数字电桥测试了铜碲镁合金的电阻率，用同步辐射装置测试了铜碲镁合金表面电子结合能，用扫描电镜（SEM）、电子能谱（EDS）分析了铜碲镁合金的形貌与组成，进而研究了镁对铜碲合金电性能的影响，研究表明：少量镁的加入，增大了合金表面电子结合能，显著降低了价电子态密度，因而加入镁的铜合金电导率要低于铜碲合金，这是由于镁固溶于铜中，使铜基体的晶格结构产生畸变，同时其价电子与铜的价电子相互作用形成化学键从而减少了纯铜价电子的数量，因而引起电阻的增加，但随着合金中镁含量的增加，合金的再结晶温度明显升高。

英文摘要：

The electrical conductivity of Cu-Te-Mg alloys was measured by SB2230 digital electrical distribution of electrons near Fermi surface were detected by synchrotron radiation instrument. Combing bridge. The binding energy and with the analysis of morphology and components by SEM and EDS, the effect of Mg on the electrical property of Cu-Te alloys was studied in this paper. The results showed that adding of trace Mg to Cu-Te alloys increased the binding energy and decreased intensity of valence electrons, leading to decrease of electrical conductivity of Cu-Te-Mg alloys. This is because Mg dissolving in copper lattice increased distortion and decreased the amount of valence electrons due to interaction of alloy elements. However, the recrystallization temperature of Cu-Te alloys increased with addition of Mg.