中文摘要：

铜合金在上的弄湿的行为原文如此，底层被一种无柄的落下技术学习。SiCp/Cu composites 和压力更少渗入机制的微观结构被分析。当 Ni， Fe，和艾尔在 wettability 的改进上有次要的影响时，结果显示 Ti 和 Cr 是有效元素改进 wettability。对弄湿转变非弄湿分别地为 Cu-3Al-3Ni-9Si 和 Cu-3Si-2Al-1Ti 发生在 1210 和 1190 ° C。所有铜合金反应与原文如此除了 Cu-3Al-3Ni-9Si 在接口形成反应层。高 Si 内容赞成界面的反应的抑制。渗入机制在压力期间，更少的渗入被归因于分解原文如此。Fe， Ni，和艾尔的有益的效果是赞成溶解原文如此。真实活跃元素在压力期间，更少的渗入是 Si。

英文摘要：

The wetting behavior of copper alloys on SiC substrates was studied by a sessile drop technique. The microstructure of SiCp/Cu composites and the pressureless infiltration mechanism were analyzed. The results indicate that Ti and Cr are effective elements to improve the wettability, while Ni, Fe, and Al have minor influence on the improvement of wettability. Non-wetting to wetting transition occurs at 1210 and 1190℃ for Cu-3Al-3Ni-9Si and Cu-3Si-2Al-1Ti, respectively. All the copper alloys react with SiC at the interface forming a reaction layer except for Cu-3Al-3Ni-9Si. High Si content favors the suppression of interracial reaction. The infiltration mechanism during pressureless infiltration is attributed to the decomposition of SiC. The beneficial effect of Fe, Ni, and Al is to favor the dissolution of SiC. The real active element during pressureless infiltration is Si.