中文摘要：

为了减少微流控芯片产品胶粘接封合的缺陷，提高胶粘接封合的效果，提出了一种室温下能够实现快速柔性胶粘接封合方法，设计了适用于该方法的胶粘接封合机。该封合机选用增压缸提供压力，采用柔性材料作为封合机的压头，压头通过浮动接头与增压缸相连，导向通过滑动轴承实现，驱动系统采用气动驱动，气动回路可实现双手操作，通过调压阀和计时器调节封合压力、保压时间，并且达到保压时间后上压头自动回位，此封合机设计改善了胶粘接封合采用纯手工封合的现状，显著提升了微流控芯片胶粘接封合工艺的自动化水平。

英文摘要：

In order to decrease the defect of adhesive bonding process and increase the bonding rate, a fast, room-temperature adhesive bonding process has been developed for fabrication of microfluidic chips. According to this process, we developed a flexible material based adhesive bonding machine. A pneumatic-hydraulic cylinder was used in this machine. The pressure head was made of flexible material, fixed by a floating joint under the pneumatic-hydraulic cylinder. It moved through the sliding bearings, which was fixed in the frame. This machine was driven by pneumatic system. For the concern of safety, this bonding machine only can be started by two hands, and the pneumatic system can control the bondingpressure by pressure regulator aud the bonding times by timer. The pressure head can return to original position automatically after achieving bonding time. This machine can improve the automation of adhesive bonding process, which only can be achieved by hands right now.