采用0.13μm工艺,4层金属布线,在标准CMOS技术的基础上增加3张掩膜制备了一款8Mb相变存储器。1.2V的低压NMOS管作为单元选通器,单元大小为50F2外围电路采用3.3V工作电压的CMOS电路。Set和Reset操作电流分别为0.4mA和2mA。读出操作的电流为10μA,芯片疲劳特性次数超过了10^8。
An 8 Mb phase change random access memory is developed in a 0. 13 μm 4-ML standard CMOS technology. The storage element is integrated using 3 additional masks with respect to process baseline. The cell selector is implemented by a standard 1.2 V NMOS device, achieving a cell size of 50 F2. 3.3 V CMOS devices are used for the peripheral circuit. The current of the Set operation and the Reset operation is 0.4 mA and 2 mA, respectively. 10μA current offers to readout operation. The endurance characteristics is measured to be over 10^8.