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3D Modeling and Simulation of Dendritic Growth during Solidification
  • ISSN号:1005-0302
  • 期刊名称:《材料科学技术学报:英文版》
  • 时间:0
  • 分类:TM3[电气工程—电机]
  • 作者机构:Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
  • 相关基金:The work was sponsored by the Significant Project of National Natural Science Foundation of China(No.59990470-3), the National Significant Fundamental Research Project of the Ministry of Science and Technology of China(No. G2000067208-3) and the Fundamental Research Project of Tsinghua University.
中文摘要:

A mathematical model for the three-dimensional simulation of free dendritic growth and microstructure evolutionwas developed based on the growth mechanism of crystal grains and basic transfer equations such as heat, massand momentum transfer equations. Many factors including constitutional undercooling, curvature undercooling andanisotropy, which had vital influences on the microstructure evolution, were considered in the model. Simulated resultsshowed that final microstructural patterns and free dendritic growth could be predicted reasonably and calculatedresults were coincident with experimental The simulated results of free dendritic growth indicated that the strength ofanisotropy has significant effects on free dendritic growth, dendrite profile, micro solute and temperature distribution.The dendritic grain profiles with fully-grown parallel secondary arm tend to be formed at the intensive anisotropy,while near octahedral grain profiles with small protuberances of surface at low strength of anisotropy. The simulatedresults of free dendritic growth also indicated that there are small molten pools left in interdendritic areas. This ishelpful to understand the fundamental of the formation of microstructure related defects such as microsegregationand microporosity.

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期刊信息
  • 《材料科学技术学报:英文版》
  • 中国科技核心期刊
  • 主管单位:中国科协
  • 主办单位:中国金属学会
  • 主编:
  • 地址:中国沈阳文化路72号
  • 邮编:110016
  • 邮箱:
  • 电话:024-83978208
  • 国际标准刊号:ISSN:1005-0302
  • 国内统一刊号:ISSN:21-1315/TG
  • 邮发代号:
  • 获奖情况:
  • 国家“双百”期刊
  • 国内外数据库收录:
  • 俄罗斯文摘杂志,美国化学文摘(网络版),荷兰文摘与引文数据库,美国工程索引,美国剑桥科学文摘,美国科学引文索引(扩展库),日本日本科学技术振兴机构数据库,中国中国科技核心期刊
  • 被引量:474