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Microstructures and tensile properties of copper-wire-reinforced Sn-Bi alloy micro-composite fabrica
  • ISSN号：0268-3768
  • 期刊名称：International Journal of Advanced Manufacturing Te
  • 时间：2015.2.21
  • 页码：897-904
  • 相关项目：微型腔叠层滑焊成形方法及其沉积效应机理研究
作者： Bin Xu|Xiaoqiang Chen|Rong Cheng|Shuangchen Ruan|
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微型腔叠层滑焊成形方法及其沉积效应机理研究
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