中文摘要：

采用脉冲旁路耦合电弧MIG熔钎焊方法,利用ER4047铝合金焊丝在T2铜板上进行平板堆焊实验,通过调节焊接参数获得良好焊缝成形.利用SEM、EDS和XRD等测试手段对连接界面区的微观组织进行观察和分析.结果表明：在连接界面区从铜侧到铝侧依次生成条状的Cu9Al4、块状的CuAl2金属间化合物和絮状的α（Al）＋θ（CuAl2）共晶体,且金属间化合物层的厚度随着母材热输入的增加而增大,同时块状脆性金属间化合物尺寸变大.对熔钎焊接头进行显微维氏硬度测量,结果显示,铝-铜熔钎焊焊接接头金属间化合物区域显微硬度最高达406.7HV,说明铝-铜熔钎焊连接界面区出现脆硬相.

英文摘要：

Pulse fusing-brazing DE-MIG welding and ER4047 aluminum welding wire were used to carry out bead welding experiment on T2 copper plate.The good weld formation was obtained through adjusting the welding parameters.The microstructure of the interface in bonded region was observed and analyzed with SEM,EDS and XRD.The results showed that trip Cu9Al4,lumpy CuAl2 intermetallic compound,and flocculentα（Al）＋θ（CuAl2）eutec were generated successively in the interface of bonded region from copper side to aluminum side and the thickness of intermetallic compound layer increased with the increasing of heat input of base metal.Meanwhile,the size of lumpy fragile intermetallic compound became larger.The Vickers microhardness of the welding joint was measured and it was found that the Vickers microhardness of the joints in intermetallic compound area would reach up to 406.7HV,indicating that hard brittle phase took place in the area of joint interface of fusing-brazing welding of aluminum and copper.