微机电系统的发展,对微细加工技术提出了更高的要求。目前常用的微细制造技术本质是基于掩模光刻的二维半微加工技术,难以进行真三维结构的制造。对单光子和双光子微细光成形技术的成形原理、加工分辨能力进行分析和实验研究,将其与微细电铸等工艺集成,提出一种能实现真三维制造的、具有不同应用材料的微细加工新方法,并从原理上验证了两者集成的可行性,为后续研究奠定了基础。微细光成形与微细电铸集成工艺技术为进一步拓展微细制造技术提供了新途径。
With the development of Micro Electro Mechanical Systems, micro fabrication technolo gies face the challenge. Nowadays micro fabrication techniques are usually based on the mask lithography and resulted 2.5D fabrications. It is difficult to fabricate real 3D structures. The solidification principles and fabrication resolutions of single-photon and two-photon Micro Stereo Lithography (MSL) were studied. The authors attempted to integrate MSL and Micro Electroforming and raised a novel micro fabrication technique which could be used to fabricate real 3D structures and applied to different materials. The feasibility of the integration of two technologies is proved in principles and it is ready for further study and analysis. This integrated technology offers a new way for developing micro fabrication technologies.