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The damage mechanisms during lapping and mechanical polishing CdZnTe wafers
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  • 相关项目：各向异性软脆功能晶体高效精密和超精密加工技术基础
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各向异性软脆功能晶体高效精密和超精密加工技术基础
期刊论文 56 会议论文 15 获奖 1
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