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Wetting of Cu substrates with micrometer and nanometer grains by molten Sn-3.5Ag-0.7Cu alloy
  • ISSN号：0142-2421
  • 期刊名称：Surface and Interface Analysis
  • 时间：2010.12.12
  • 页码：1681-1684
  • 相关项目：锡钎料在亚稳结构表面的润湿行为与微观机制
作者： Shen, Ping|Yin, Zhongfa|Yang, Jun|Sun, Jianxin|Jiang, Zhonghao|Jiang, Qichuan|
同期刊论文项目
锡钎料在亚稳结构表面的润湿行为与微观机制
期刊论文 9 专利 1
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