中文摘要：

提出一种新型的多孔微热沉系统来实现高热流密度电子元器件封装散热的需求,分析了多孔微热沉系统的工作原理和特点,建立了微热沉金属壁面的传热以及多孔区域的流动与传热的耦合数学模型,并用SIMPLE算法对其进行整场求解,详细讨论了不同的热流、回流液入口速度以及进口位置对多孔微热沉传热性能的影响。数值计算结果表明,多孔微热沉在高热流密度情况下,加热表面能维持较低的温度水平。热流越大,加热表面的温度就越高;增加回流液体的入口速度可以明显的降低微热沉加热表面及底面的温度水平;多孔微热沉的下进口方式能够减小散热表面温度的不均匀性。多孔微热沉系统能有效解决高热流密度电子元器件的散热问题,提高器件可靠性与使用寿命。

英文摘要：

A novel porous micro heat sink system was presented for dissipating the high heat flux of electronic devices,and the operational principle and characteristics of the micro heat sink were analyzed.A numerical model used to describe the liquid flow and heat transfer in the porous region and the heat transfer in the metallic wall for the micro heat sink was proposed and solved with SIMPLE algorithm as a conjugate problem.The influences of heat flux,inlet fluid velocity and inlet location of micro heat sink were discussed in detail.The numerical results show that the heated surface temperature of the porous micro heat sink is low at high heat flux,and the higher heat flux results in higher temperature of the heated surface.Increasing inlet fluid velocity could greatly decrease the temperature of the heated surface and bottom surface of the micro heat sink.The temperature of the heated surface could maintain good isothermal characteristic when inlet locates in the bottom of the micro heat sink.The micro heat sink has good cooling performance for electronic devices at high heat flux,and it can improve the reliability and working life of electronic devices.The numerical results obtained are useful for performance optimization and design of porous micro heat sink.