以市售SiO2粉体为主要研究对象,采用X射线衍射线形分析、激光粒度分析和Zeta电位分析等表征手段,研究了球磨作用对改性SiO2晶体结构、粒度和Zeta电位的影响.结果表明,SiO2分别经空气气氛中干磨、以N,N-二甲基甲酰胺(DMF)为球磨分散介质的湿磨、以二甲基甲酰胺(DMF)为球磨分散介质和以硅烷偶联剂KH-560为改性剂的湿磨后,其结构性质有显著差异,分别经过3 h球磨后,干磨、湿磨、添加10%硅烷偶联剂并湿磨和添加20%硅烷偶联剂并湿磨后SiO2平均晶粒尺寸分别为46.9, 31.4, 24.5和75.9 nm,其平均晶格畸变率分别为0.0253%, 0.0871%, 0.117%和0.063%,中位粒径分别为4.241, 1.586, 1.321和5.092 mm.
The effects of non-aqueous ball milling on the structure and properties of modified silicon dioxide particles were investigated using X-ray powder diffraction, particle size analysis and zeta potential analysis, etc. The results indicate that the structure, particle size and zeta potential of modified silicon dioxide are related to the grinding conditions. Different modified silicon dioxide powder samples are obtained after ball-milling in air, DMF, DMF with 10% silane coupling agent, and DMF with 20% silane coupling agent, respectively. For example, after ball-milling 3 h, the average crystallite sizes of the above corresponding modified silicon dioxide samples are 46.9, 31.4, 24.5 and 75.9 nm, respectively, and average lattice distortion (ε) of the above corresponding modified silicon dioxide samples is 0.0253%, 0.0871%, 0.117% and 0.063%, respectively. The medium diameters of the above corresponding modified silicon dioxide powder samples are 4.241, 1.586, 1.321 and 5.092 μm, respectively.