欢迎您！东篱公司
退出
-
申报数据库
-
立项数据库
-
成果数据库
-
项目获奖数据库
中文摘要：
虽然表面贴装制造工艺已经纯熟,但是随着BGA封装的广泛应用以及焊球间距的逐步减小,给表面贴装制造工艺带来了新的挑战。基于BGA封装在表面贴装技术焊接中的应用,从印制电路板焊盘设计、印制电路板板材选取和保护、BGA封装选取和保护、印刷工艺、回焊炉温度曲线设定与控制等方面,阐述了影响BGA封装焊接技术的各个因素,进而提升BGA封装焊接质量的可靠性。
英文摘要：
Although SMT manufacturing process have been matured,but with the wide application of BGA and smaller pitch between solder balls,many challenges for SMT have been brought.The factors which influence BGA soldering quality are discussed from PCB pad design,selecting and protection of PCB and BGA,solder paste print process,and reflow profile,based on BGA application in SMT,in order to improve BGA soldering quality and reliability.
位置：
同期刊论文项目
