利用B2O3助熔剂法结合SPS技术制备了Mg2-xZnxSi0.99Sb0.01(0≤x≤0.1)固溶体。测量了300-780 K温度区间内试样的电导率、塞贝克系数和热导率。发现晶格热导率随Zn取代量的增大而降低。而电导率随Zn取代量的增大而先降低后增大。讨论了影响电导率与晶格热导率的变化规律的具体内在机制。所有样品中x=0.075样品的功率因子最高,在780 K达1.76 mW·m^-1·K^-2,比基体Mg2-xZnxSi0.99Sb0.01高约18%。x=0.1样品具有最低晶格热导率,在770 K达到2.86 W·m^-1·K^-1。低晶格热导率使Mg2-xZnxSi0.99Sb0.01具有最高热电优值,在780 K达0.37。
Mg2-xZnxSi0.99Sb0.01(0≤x≤0.1) solid solutions were prepared by a B2O3 flux method combined with a spark plasma sintering(SPS) technique. The electrical conductivity, Seebeck coefficient and thermal conductivity were measured as a function of temperature from 300 K to 780 K. It is found that the lattice thermal conductivity reduces with Zn content increasing; however, the electrical conductivity first decreases and then increases. The underlying mechanism was discussed. Results show that among the samples, the maximum PF(power factor) of 1.76 mW·m^-1·K^-2 at x=0.075 is obtained at 780 K, about 18% higher than that of Mg2-xZnxSi0.99Sb0.01. The lowest lattice thermal conductivity of 2.86 W·m^-1·K^-1 is obtained at 770 K for the x=0.1 sample. As a result, a maximum dimensionless figure of merit of 0.37 is obtained for Mg2-xZnxSi0.99Sb0.01 at 780 K.