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Printed electrically conductive composites: conductive filler designs and surface engineering
  • ISSN号：2050-7526
  • 期刊名称：Journal of Materials Chemistry C
  • 时间：2013
  • 页码：4052-4069
  • 相关项目：表面卤化降低导电银胶接触电阻的机理研究
作者： Yang, Cheng|Wong, Ching Ping|Yuen, Matthew Ming Fai|
同期刊论文项目
表面卤化降低导电银胶接触电阻的机理研究
期刊论文 13
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