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Scratching of copper with rough surfaces conducted by diamond tip simulated using molecular dynamics
  • ISSN号：0268-3768
  • 期刊名称：International Journal of Advanced Manufacturing Te
  • 时间：2015.3.1
  • 页码：1057-1070
  • 相关项目：含纳米团簇的铁素体合金高温强化与断裂机理研究
作者： Jia Li|Qihong Fang|Youwen Liu|Liangchi Zhang|
同期刊论文项目
含纳米团簇的铁素体合金高温强化与断裂机理研究
期刊论文 80
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