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中文摘要：
采用热压扩散焊接法制备了Ti/Cu层状复合材料,并通过SEM、EDS、四电子探针及万能材料试验机等分析测试手段对样品的微观结构和性能进行表征。结果表明,热压扩散焊接法在焊接温度800℃、压力3.5 MPa时,随保温时间的增加,扩散层厚度逐渐增厚;不同保温时间下均生成4个亚层,各亚层金属间化合物依次为Cu4Ti、Cu4Ti3、CuTi、CuTi2;在保温时间为60 min时,复合材料有最小的电阻率(3.634×10-8Ω·m),仅为纯钛的8.65%;复合材料的抗弯曲性能随扩散层厚度的增加而增加。
英文摘要：
Microstructure and properties of the Ti/Cu layer composite materials prepared by the hot-pressing diffusion welding method were analyzed by SEM , EDS, four-probe method and universal material testing machine .The results show that the diffusion layer thickness gradually thickens with the increase of holding time at 800 ℃and 3.5 MPa.The diffusion layer contains 4 sub-layers, and the intermetallic compound in each sub-layer is Cu4Ti, Cu4Ti3, CuTi and CuTi2, respectively.The composite material has a minimum resistivity of 3.634 × 10 -8 Ω· m, which is only 8.65% of that of pure titanium when the holding time is 60 min.Anti-bending performance of the composite materials increase with the increase of the diffusion layer thickness .
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Stability, elastic properties and electronic structures of the stable Zr-Al intermetallic compounds:
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