在聚合物的熔融或玻璃化转变温度以上,非交联聚合物基复合材料的电阻呈现负温度系数(NTC)行为.针对其微观机制,研究者提出了各种假设.然而,由于受研究手段的制约,通过实验证据以及现有的理论来说明NTC行为仍具有很大的难度.迄今大多都是通过研究体系的电行为、基体的粘度与模量在体系熔融前后的变化来推测NTC现象的起因,没有或忽视了对熔体微观结构形成与演化的追踪.
The study on the correlation between time dependence of electrical resistivity and dynamic storage modulus for carbon black(CB) filled polymer composites was carried out. With the increase of the dynamic storage modulus(G') as well as the normalized dynamic storage modulus( G'c/G'p ), the volume resistivity(p) deceases with the increase of annealing time beyond the Tm of the composites. It is believed that this phenomenon can be used for examining the development of agglomerate structure of filled composites and illustrating the micro-mechanism of the NTC behavior. It is assumed that melting treatment to CB filled composites results in a higher modulus and lower resistivity due to more even local dispersion of the particles and formation of perfect CB network structure within the matrix.