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MSC复合生物材料促进缺血性糖尿病溃疡愈合的研究
  • ISSN号:1672-5042
  • 期刊名称:《局解手术学杂志》
  • 时间:0
  • 分类:R587.2[医药卫生—内分泌;医药卫生—临床医学;医药卫生—内科学]
  • 作者机构:[1]昆明军区总医院急诊科,云南昆明650000, [2]第三军医大学人体解剖学教研室,重庆400038
  • 相关基金:国家自然科学基金资助项目(31200731)
中文摘要:

目的观察MSC复合生物材料对缺血性糖尿病溃疡愈合的作用,探讨干细胞复合生物材料的临床应用前景。方法制作电纺丝生物材料,培养MSC细胞,通过电镜观察、增殖实验及条件培养基对内皮细胞的作用研究MSC复合生物材料的离体效果。并使用5~8周龄雄性C57BL/6J小鼠制备成糖尿病小鼠,结扎股动脉近端,在大腿背侧皮肤造成直径5 mm全层创面。观察MSC复合生物材料治疗糖尿病足缺血性溃疡的效果。结果本研究发现将MSC种植与生物电纺丝材料上,通过扫描电镜观察,细胞生长良好,细胞足伸展,细胞间连结建立。高糖刺激下,MSC在生物材料上具有更强的生长增殖能力。利用MSC在生物材料上生长的条件培养基作用人脐静脉内皮细胞,发现内皮细胞增殖能力增强。将单独的MSC和MSC复合生物材料覆盖在糖尿病小鼠大腿皮肤损伤处,发现MSC复合生物材料能够有效提高MSC对糖尿病足溃疡的治疗效果,促进伤口愈合,有利于血管生成。结论MSC复合生物材料能够促进糖尿病足缺血性溃疡愈合。提示干细胞复合生物组织材料在加速糖尿病足等缺血性溃疡愈合方面具有很大治疗潜力和应用前景。

英文摘要:

Objective To observe the effect of mesenchymal stem cells( MSC) in treating ischemic diabetic ulcers,and to explore its clinical perspectives. Methods Prepared electro-spinning biomaterials and cultured MSC to study effect of MSC composite biomaterials in vitro by scanning electron microscope,MTT array and influence of MSC conditioned medium on endothelial cells. The use of 5 to 8 week old male C57 BL /6J mice were prepared into diabetic mice,femoral artery ligation in the proximal thigh,in dorsal skin full-thickness wounds caused by the diameter 5 mm. Then the effect of MSC composite biomaterials on ischemic diabetic ulcers was determined. Results This study found that the MSC grow well on electro-spinning biomaterials. Cells foot extension and connections between cells were observed by scanning electron microscope. Stimulated by high glucose,growth and proliferation of MSC has a stronger ability on biomaterials. MSC conditioned medium on biomaterials increased human umbilical vein endothelial cells proliferation ability. Conclusion MSC composite biomaterials can effectively improve the treatment effect of MSC on ischemic diabetic ulcers. The study indicated stem cells composite biomaterials have great potential and application prospect in the treatment of ischemic diabetic ulcers healing.

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期刊信息
  • 《局解手术学杂志》
  • 中国科技核心期刊
  • 主管单位:重庆市科学技术协会
  • 主办单位:重庆市解剖学会 第三军医大学
  • 主编:张邵祥
  • 地址:重庆市沙坪坝区高滩岩正街30号
  • 邮编:400038
  • 邮箱:jjssxzz@163.com
  • 电话:023- 68752649 68752251
  • 国际标准刊号:ISSN:1672-5042
  • 国内统一刊号:ISSN:50-1162/R
  • 邮发代号:78-161
  • 获奖情况:
  • 国内外数据库收录:
  • 被引量:14084