本文报导了利用混合物理化学气相沉积法(Hybrid physical-chemical vapor deposition,HPCVD)在SiC(0001)衬底上制备干净的MgB2超薄膜.在背景气体压强、载气H2流量等条件一定的情况下,改变B2H6流量及沉积时间,制备不同厚度的MgB2超薄膜样品,并研究了超导转变温度Tc、剩余电阻率ρ(42K)、上临界场Hc2等与膜厚的关系.这系列超薄膜生长沿c轴外延,随膜厚度的变小Tc(0)降低,ρ(42K)升高.膜在衬底上的生长遵循Volmer-Weber岛状生长模式.对于10nm厚的膜,Tc032.4K,ρ42K124.92μΩ·cm,其表面连接性良好,平均粗糙度为2.72nm,上临界磁场Hc20K12T,零场4K时的临界电流密度Jc107A/cm2,为迄今为止所观测到的10nm厚MgB2超薄膜的最高Jc值,这也证明了10nm厚的MgB2膜在超导纳米器件上具有很强的应用潜力.
We fabricated MgB2 ultra-thin films via hybrid physical-chemical vapor deposition (HPCVD) technique. Under the same background pressure,the same H2 flow rate,by changing B2H6 flow rate and deposition time,we made a series of ultra-thin films,thickness ranging from 5nm to 80nm. These films grew on SiC substrate,all c-axis epitaxial. The film formation obeys the Volmer-Weber mode. As the thickness increases,critical transition temperature Tc(0) also increases,the residual resistivity decreases. Especially,a very high Tc(0) 32.4K,low residual resistivity ρ42K124.92μΩ·cm,and extremely high critical current density Jc107A/cm2 (0T,4K),upper critical field Hc2(0) for 10nm film was reported. Moreover,the smooth surface of the epitaxial films,with root-mean-square (RMS) roughness2.72nm,makes them well qualified for device applications.