中文摘要：

通过采用不同的超声方式对电铸铜层进行处理,电铸过程中无超声（试样C1）、在电铸过程中超声（C2）、电铸后超声（C3）以及电铸后进行玻璃珠辅助超声（C4）,获得了与普通电铸铜层相比结构更致密,抗拉强度更高的电铸铜层。并对不同超声方式下得到的电铸铜层进行微观形貌观察及拉伸性能的测试。结果表明：试样C2由于超声作用使电铸铜层晶粒细化,并抑制了晶粒过分生长,因而与C1相比其抗拉强度提高了23.8%;而电铸后超声对电铸铜微观结构及抗拉性能几乎没有影响;试样C4在玻璃珠的碰撞与摩擦作用下获得了具有纳米晶结构,抗拉强度与C1相比提高了65.2%。

英文摘要：

Electroformed copper layers were treated by ultrasonic vibration in different ways,which are electroforming without ultrasound（sample C1）,with ultrasonic-assisted during electroforming（sample C2）,ultrasonic-vibrated after electroforming（sample C3）and ultrasonic-assisted mechanical treating by glass balls after electroforming（sample C4）.Microsturcture and tensile strength of the samples were tested.The results show that grains of the copper layer are refined and its growth is restrained in case of sample C2.As a result,tensile strength of sample C2 improves by 23.8% than that of sample C1.Microstructure and tensile strength of sample C3 are almost the same as sample C1.Nanocrystalline is obtained in sample C4 due to collision and attrition effects of the vibrating glass balls and tensile strength of sample C4 improves by 65.2% than that of sample C1.