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Flip chip bonding technology for IR detectors
  • ISSN号：1007-2276
  • 期刊名称：Hongwai yu Jiguang Gongcheng/Infrared and Laser En
  • 时间：2014
  • 页码：722-726
  • 相关项目：太赫兹波段金属/重掺半导体表面等离子体慢光效应的研究
作者： Geng, Hongyan|Zhou, Zhou|Song, Guofeng|Xu, Yun|
同期刊论文项目
太赫兹波段金属/重掺半导体表面等离子体慢光效应的研究
期刊论文 36 会议论文 2
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期刊信息
  • 《红外与激光工程》
  • 中国科技核心期刊
  • 主管单位:中国航天科工集团
  • 主办单位:天津津航技术物理研究所
  • 主编：张锋
  • 地址：天津市空港经济区中环西路58号
  • 邮编：300308
  • 邮箱：irla@csoe.org.cn
  • 电话：022-58168883 /4/5
  • 国际标准刊号：ISSN：1007-2276
  • 国内统一刊号：ISSN：12-1261/TN
  • 邮发代号:6-133
  • 获奖情况:
  • 1996年获航天系统第五次科技期刊评比三等奖,1998年获航天系统第六次科技期刊评比二等奖,1997-2001年在天津市科技期刊评估中被评为一级期刊
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  • 被引量:17466