中文摘要：

为了寻找BGA焊点体积、焊盘尺寸及焊点节距之间的最佳匹配关系以提高焊接成品率,研究了焊点形态对焊接高度的影响。通过Runge-Kutta方法求解带体积约束的Young-Laplace方程,仿真分析了特定节距下焊点体积与焊盘尺寸对焊接效果的影响。结果表明,焊点体积的变化会使得整个焊点高度与承载力的关系曲线向左或者向右平移,而焊盘直径则对焊点的最大高度影响更加明显。需要同时改变焊点体积及焊盘直径以得到能够适应相应封装形式的翘曲变形。最后,按照中兴通讯股份有限公司某封装的0.4mm节距BGA的标准,分析了0.35mm节距及0.3mm节距BGA封装下焊点体积与焊盘直径的最佳匹配关系。

英文摘要：

The influences of solder joint shape on the solder joint height were studied to find the optimal matching relations of the volume, the pitch and the pad of BGA solder joint to increase solder yield. The Young-Laplace equation with the constraint of the volume was solved based on the Runge- Kutta method. The influences of the solder joint volume and diameter of pad on the solder joint height range were simulated. The results show that the whole solder joint height range shifts left or right with the changing solder joint volume. The influences of the pad diameter on the maximum height of the solder joint are of more obvious. The warping adapting to the package might be obtained by chan- ging solder joint volume and pad diameter at the same time.Based on the standard of a 0.4 mm pitch of BGA package of ZTE, the optimal matching relations of the solder joint volume and the diameter of the pad were analyzed with the 0.35 mm pitch and 0.3 mm pitch respectively.