中文摘要：

基于发光二极管（LED）参数的非接触检测的方法研究,测试研究了封装过程中LED的理想因子。探讨了影响LED理想因子的因素,测试了光致发光（PL）条件下不同LED的理想因子,对比了封装缺陷对于理想因子的影响。实验表明,结温与载流子注入强度是LED理想因子的关键因素,LED封装过程中的缺陷对理想因子具有显著影响,并且可以通过PL实现LED封装缺陷的非接触检测。

英文摘要：

The ideality factor of LED chips in packaging is measured and studied based on the non-contact detection theory of LED.An experimental analysis has been implemented to evaluate varies of light-emitting diodes′ ideality factor.The measurement of LED spectrum under photoluminescence（PL） has been taken and the comparison between the ideality factors with or without packaging faults has also been investigated.It is found that the junction temperature and the injecting intensity of carrier are factors taking the most significant effect on the ideality factor.It is also noted that packaging fault can dramatically influence the ideality factor and the photoluminescence can be applied in the non-contact detection of LED packaging fault.