采用多道激光透射封接技术,对大尺寸3.3高硼硅玻璃-可伐合金封接工艺进行了探索性研究,采用正交实验方法,实现了两种材料的可靠封接。确定了优化工艺参数:扫描速度为25mm/s,激光功率为100W,离焦量为+40mm,扫描次数2次。通过使用SEM、EDX以及激光共聚焦显微镜观测硼硅玻璃-可伐合金的激光封接断面,对比相图,就结合界面的特征和机理进行了初步分析,Fe2SiO4化合物的形成是两行能够可靠封接的主题原因,确定了两种材料的激光可封接性。
The joining behavior and interface analysis of Pyrex Glass-to-KOVAR Alloy with fiber laser were studied in the paper. By the orthogonal experiment method, the optimized parameters of laser joining were obtained: scanning speed of 25mm/s, laser power of 100W, defocus distance of +40mm, scanning number of 2. The fractures graphs were observed by LEXT OSL 3000. By analyzing the FeO-SiO2-Fe phase diagram, SEM and EDX on the fractures, it displayed that a new chemical substances (Fe2SiO4) had formed which was considered as the key-materials for a good glass-to-KOVAR alloy joint.