中文摘要：

以柠檬酸盐、酒石酸盐为主配位剂，研究了锌基合金上碱性无氰镀铜工艺。镀液组成和工艺条件为：二水合氯化铜16g／L，柠檬酸钾82g／L，酒石酸钾钠20gm，胺化合物29g／L，硼酸30g／L，氯化钾28g／L，氢氧化钾20g／L，光亮剂0．01mL／L，温度45℃，pH为9（用KOH或盐酸调节），镀液搅拌，电流密度1．0A／dm^2。研究了搅拌、镀液温度、pH、铜离子质量浓度和添加剂对镀层外观的影响。测试了镀液的电流效率，深镀能力，分散能力，抗杂质能力，与基体的结合力，表面形貌和结构。结果表明，添加剂体积分数在0．01～1．50mL／L范围内均可获得光亮的镀层；电流效率随电流密度、温度和pH的提高而增大；镀液有较强的抗杂质能力，深镀能力达100％，分散能力为84．1％，电流效率在90％左右。镀层晶粒细小、致密、平整，颗粒分布均匀，与基体结合牢固。

英文摘要：

The process of alkaline non-cyanide copper electroplating on zinc-based alloy substrate was studied by using citrate and tartrate as main complexing agents. The bath composition and operation conditions are as follows： CuCl2·2H2O 16 g/L, potassium citrate 82 g/L, sodium potassium tartrate 20 g/L, amine compound 29 g/L, H3BO3 30 g/L, KCl28 g/L, KOH 20 g/L, brightening agent 0.01 mL/L, temperature 45 ℃, pH 9 （adjusting with KOH or HCl）, solution agitation and current density 1.0 A/dm^2. The effects of agitation, bath temperature, pH, copper ions Concentration and additive on the appearance of deposit were studied. The current efficiency, bath coveting power and throwing power, impurity resistance, adhesion strength, surface morphology and structure were examined. The results showed that a bright copper deposit can be obtained with additives 0.01-1.5 mL/L. The current efficiency is increased with increasing current density, bath temperature and pH. The bath has good resistance to impurities, covering power 100%, throwing power 84.1% and current efficiency about 90%. The deposit is fine-grained, uniform, compact, smooth and well-adhered.