中文摘要：

根据实际工业工艺流程和服役工况,制备接近真实服役状态下的微电子封装中无铅焊点界面化合物试样;采用扫描电镜（SEM）和能量色散X射线荧光光谱仪（EDX）确定IMC的形貌厚度和化学成分;根据W.C.Olive算法,利用连续刚度测量（CSM）技术,实现了IMC层、焊料和Cu的弹性模量、硬度随压痕深度变化的连续测量,得到IMC层材料的硬度和弹性模量分别为（5.2±0.2）GPa和（104.51±2.62）GPa。根据纳米压痕结果,焊料、Cu和IMC蠕变应力指数从小到大分别为15.129、61.463和70.27。

英文摘要：

The samples were prepared according to actual reflow soldering condition and service. The micro- structural and chemical analyses of the samples were measured by using scanning electron microscopy （SEM） equipped with energy dispersive X-ray analysis （EDX）. With W. C. Oliver method and continuous stiffness measurement （CSM） technique, continuous values of hardness and elastic modulus varying with the indentation depth for IMC were measured, the elastic modulus and hardness of IMC was （5. 2 4-0. 2）GPa and （104. 51 2.62） GPa. The creep stress exponents were 15.129,61.463,70.27 for solder, Cu and IMC respectively.