中文摘要：

镍 electroplating 过程借助于电气化学的噪音被调查(在) ，与扫描电子显微镜学(SEM ) 一起的循环伏安法技术。结果证明处于试验性的条件并且随电流密度的增加，镍雏晶的生长机制从 2-D 改变到 第3-Dwi 潜在的拐弯处点关于 -1.15 V ，并且为整体镍 electroplating 进程的散开控制的发作的潜力关于 -1.4 V 。在情况ofactivation控制，二维( 2-D )镍的成核/生长过程经常在仅仅慢慢地小的积极潜在的飘移和相应紧缩的 layer-by-layer 存款的特征导致电镀物品结晶化结构，和最大的亲戚theRP电子数据处理(重新阴谋的相对精力分发阴谋)的精力，它从小浪分析被获得，与更小的规模在这个区域定义。当时在散开控制下面，三维( 3-D )镍的成核/生长过程，经常在快积极潜在的飘移和随后的显著否定潜在的飘移和镍沉积物的相应 dentritic/large 集团企业结构的特征导致电镀物品结晶化，并且RP电子数据处理的最大的相对精力与更大的规模在这个区域定义。electroplating 时间在每雏晶附近主要通过它对雏晶和 theNi~(2+) 离子散开过程的生长率的影响影响镍存款结构。

英文摘要：

The nickel electroplating process was investigated by means of electrochemical noise（EN）, cyclic voltammetry in conjunction with the scanning electron microscopy（SEM） technique. The results show that, in the experimental conditions and with the increase of current density, the growth mechanism of nickel crystallites changes from 2-D to 3-D with the potential turning point of about - 1.15 V, and the potential for the onset of diffusion control of the ensemble nickel electroplating process was about --1.4 V. In the case of activation-control, the two-dimensional （2-D） nucleation / growth process of nickel often results in the electrocrystallization EN features of only slowly small positive potential drift and the corresponding compact layer-by-layer deposit structure, and the maximum relative energy of the RP-EDP （re-plotted relative energy distribution plot）, which is obtained from wavelet analysis, defmed in the region with smaller scales. While under the diffusion-control, the three-dimensional （3-D） nucleation / growth process of nickel, often results in the electrocrystallization EN features of both the fast positive potential drift and subsequent remarkable negative potential drift and the corresponding dentritic/large conglomerate structure of nickel deposit, and the maximum relative energy of the RP-EDP defined in the region with larger scales. The electroplating time affects the nickel deposit structure mainly through its influence on the growth rate of crystallites and the Ni^2＋ ions diffusion process around each crystallite.