为了揭示SO4^2-对块体纳米晶铜耐蚀性能的影响规律,利用电化学方法,结合X射线衍射、能谱分析、扫描电镜等表面分析技术,研究了惰性气体沉积原位温压法制备的块体纳米晶铜在不同质量分数(0.3%、1.3%、2.3%、3.3%和4.3%)Na2SO4溶液中的阳极极化行为.结果表明,随着SO4^2-的增多,纳米晶铜的致钝电流密度增大,而致钝电位降低.在0.3%的Na:SO。溶液中加入1Yoo的NaCl,纳米晶铜阳极极化行为发生明显变化,Cl-在纳米晶铜表面形成难溶于水的CuCl保护钝化膜,纳米晶铜致钝电流密度降低,活化-钝化过渡区电流密度下降速率显著减小.
To investigate the influence of SO4^2- on the corrosion performance of nanocrystalline (NC) copper bulk, the corrosion tests were performed using electrochemical method, X-ray diffraction (XRD), energy dispersive spectroscopy (EDS) and field emission gun scanning electron microscopy (FEGSEM) technique in the 0.3 %, 1.3 %, 2.3 %, 3.3 % and 4. 3 % Na2 SO4 corrosion solutions. The NC copper bulk was prepared by inert gas condensation and in situ warm compress (IGCWC). The results showed that with the increase of sulfate ion concentration, the critical current intensity increased but the potential decreas- esd. After adding 1% NaCl into 0.3% Na2SO4 solution, the anodic polarization behavior of NC copper changed significantly. The critical current intensity decreased and the decreasing rate of anodic current intensity lowered notably in the range of activity-passivity zone. These changes were attributed to the CuCl protective film on the NC copper.