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中文摘要：
采用一种新的掺杂方法制备了Cu掺杂的LiV3O5，该方法设备简单，热处理温度较低．电化学性能测试表明，Cu掺杂和水处理可以使层间距变大，电导率提高，从而促进Li^＋离子的扩散，使Li^＋的嵌脱变得容易，改善了掺杂材料的充放电循环性能．其中掺杂量为0．05的样品首次放电容量为265．0mAh／g，100周后为227．7mAh／g，容量损失仅为14％．
英文摘要：
Cu-doped LiV3O8 was prepared by mixing Cu powder with LiV3O8 prepared at 500℃ for 16 h. By comparison, the copper doping and water-supported structure result in larger interlayer spacing, higher electronic conductivity and faster Li^＋ diffusion, which leading to Li^＋ intercalation/deintercalation become easier and improve electrochemical performance of the material. Cu0.5-doped-LiV3O8 is better than the undoped one, which has initial discharge capacity of 265.0 mAh/g and kept 227.7 mAh/g after 100 cycles with only 14% decay.
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