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Interfacial phase formation of Al-Cu bimetal by solid-liquid casting method
  • ISSN号:1005-0302
  • 期刊名称:《材料科学技术学报:英文版》
  • 时间:0
  • 分类:TG146.21[金属学及工艺—金属材料;一般工业技术—材料科学与工程;金属学及工艺—金属学]
  • 作者机构:[1]School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, Liaoning, China, [2]Research Institute of Mechatronics & Automation, Bohai University, Jinzhou 121003, Liaoning, China, [3]School of Chemical Engineering, Dalian University of Technology, Dalian 116024, Liaoning, China
  • 相关基金:financially supported by the National Natural Science Foundation of China(Nos.51074031 and 51501027); the China Postdoctoral Science Foundation(No.2015M570246); the Fundamental Research Funds for the Central Universities of China[DUT15RC(3)065]
中文摘要:

稳固液体的方法被用来准备由液体的铜 cladding 铝的连续的扔铝合金和稳固的铜,和在不同流的温度的 Al-Cu 膨胀率不同的金属片的界面的阶段形成(700, 750, 800 湩潴琠敨氠煩極 吗?

英文摘要:

The solid-liquid method was used to prepare the continuous casting of copper cladding aluminium by liquid aluminum alloy and solid copper, and the interfacial phase formation of Al-Cu bimetal at different pouring temperatures(700, 750, 800 oC) was investigated by means of metallograph, scanning electron microscopy(SEM) and energy dispersive spectrometry(EDS) methods. The results showed that the pouring temperature of aluminum melt had an important influence on the element diffusion of Cu from the solid Cu to Al alloy melt and the reactions between Al and Cu, as well as the morphology of the Al-Cu interface. When the pouring temperature was 800 oC, there were abundant Al-Cu intermetallic compounds(IMCs) near the interface. However, a lower pouring temperature(700 oC) resulted in the formation of cavities which was detrimental to the bonding and mechanical properties. Under the conditions in this study, the good metallurgical bonding of Al-Cu was achieved at a pouring temperature of 750 oC.

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期刊信息
  • 《材料科学技术学报:英文版》
  • 中国科技核心期刊
  • 主管单位:中国科协
  • 主办单位:中国金属学会
  • 主编:
  • 地址:中国沈阳文化路72号
  • 邮编:110016
  • 邮箱:
  • 电话:024-83978208
  • 国际标准刊号:ISSN:1005-0302
  • 国内统一刊号:ISSN:21-1315/TG
  • 邮发代号:
  • 获奖情况:
  • 国家“双百”期刊
  • 国内外数据库收录:
  • 俄罗斯文摘杂志,美国化学文摘(网络版),荷兰文摘与引文数据库,美国工程索引,美国剑桥科学文摘,美国科学引文索引(扩展库),日本日本科学技术振兴机构数据库,中国中国科技核心期刊
  • 被引量:474