稳固液体的方法被用来准备由液体的铜 cladding 铝的连续的扔铝合金和稳固的铜,和在不同流的温度的 Al-Cu 膨胀率不同的金属片的界面的阶段形成(700, 750, 800 湩潴琠敨氠煩極 吗?
The solid-liquid method was used to prepare the continuous casting of copper cladding aluminium by liquid aluminum alloy and solid copper, and the interfacial phase formation of Al-Cu bimetal at different pouring temperatures(700, 750, 800 oC) was investigated by means of metallograph, scanning electron microscopy(SEM) and energy dispersive spectrometry(EDS) methods. The results showed that the pouring temperature of aluminum melt had an important influence on the element diffusion of Cu from the solid Cu to Al alloy melt and the reactions between Al and Cu, as well as the morphology of the Al-Cu interface. When the pouring temperature was 800 oC, there were abundant Al-Cu intermetallic compounds(IMCs) near the interface. However, a lower pouring temperature(700 oC) resulted in the formation of cavities which was detrimental to the bonding and mechanical properties. Under the conditions in this study, the good metallurgical bonding of Al-Cu was achieved at a pouring temperature of 750 oC.