中文摘要：

采用粒径为10、25、40μm的金属Cu粉与平均粒度为3ttm的w粉，通过伪半固态触变挤压铸造制备了W-40Cu合金筒形件。结果表明，在加热温度为1350℃、挤压力为500MPa的条件下，减小Cu粉粒径有利于触变挤压铸造成形件力学性能的提高；Cu粉粒径越细，成形件导电性能越好。

英文摘要：

Thixo-die-forging process in pseudo-semi-solid state was used to prepare W-40Cu cup shell with copper particle size in 10 μm, 25 μm,40 μm and tungsten particle size in 3 μm. The results show that with the heating temperature of 1 350℃ and applied pressure of 500 MPa, the decrease of copper parti- cle size is favorable for the improvement of mechanical properties of thixoforged parts. With the copper particle size decrease, conductive properties of thixoforged parts are increased.