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A Universal Rule for Organic Ligand Exchange
  • ISSN号：1944-8244
  • 期刊名称：ACS Applied Materials & Interfaces
  • 时间：2014.10.22
  • 页码：19035-19040
  • 相关项目：电子隧穿还原对溶液中贵金属纳米材料生长的影响
作者： Hongjun You|Wenjin Wang|Shengchun Yang|
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电子隧穿还原对溶液中贵金属纳米材料生长的影响
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