中文摘要：

AuSn20钎料以其优异的综合性能,广泛应用于高可靠微电子器件和光电子器件封装。但AuSn20共晶合金铸态组织的粗大和初生金属间化合物相分布的不均匀导致合金脆性较大,制备成形困难,其制备工艺是目前的研究热点。介绍了固态成形工艺、液态成形工艺、薄膜工艺和快速凝固工艺制备AuSn20钎料的原理和特点,指出了制备工艺的发展方向。

英文摘要：

AuSn20 solder is widely used in the areas of high reliability microelectronic devices and optoelectronic devices packaging due to its excellent comprehensive properties.However,the coarse as-cast microstructure and inhomogeneous distribution of primary phase can result in the brittleness of the AuSn20 alloy,so it is difficult to prepare.Research of the preparation technology for the AuSn20 solder has been one of current hotspots.The principle and characteristics to prepare AuSn20 alloy solder using solid forming technology,liquid forming technology,thin-films technology and rapid solidification technology were reviewed,and the development direction of the preparation technology for the AuSn20 solder were also pointed out.