采用透射电子显微镜对粉末冶金法制备的Y2O3/Ag复合材料的界面微观结构进行了深入研究。结果表明:复合材料界面结合紧密且无任何反应物。Ag基体的(111)面与Y2O3颗粒的(440)晶面保持半共格关系:Y2O3(222)//Ag(111),Y2O3(440)//Ag(1^-11),界面处基体中可以看到由于晶格错配而产生的刃位错,说明基体与增强颗粒晶面间距接近时,基体可以依靠增强颗粒表面结晶并长大,即增强颗粒作为基体异质形核的质点,并从晶体学角度对界面的形成原因进行了解释。由力学和电学性能测试得到复合材料的强度和电阻率随Y2O3含量的增加而升高。
The microstructures at the interfaces of Y2O3/Ag composite manufactured by powder metallurgy were investigated by transmission electron microscopy (TEM). The results indicated that no resultant production was found along the interfaces, and several semi-coherent interface relationship, such as Y203 (222)//Ag( 111 ), Y203 (440)//Ag( 1^-11 ), were characterized along the explored interfaces of the composite. An edge dislocation was also found along one of the interfaces. It could be deduced that the Ag matrix could nucleate and grow basing the nearby strengthening particle only when there was no obvious difference between value of the crystal plane spacing of the matrix and the strengthening particle, and the strengthening particles can act as sites for heterogeneous nucleation of Ag matrix. At same time, the reason for forming such interface features was analyzed from the viewpoint of crystallography. The strength and resistivity of composites increases with the increasing of Y203 content obtained by mechanical and electrical performance tests.