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Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver past
  • ISSN号：0954-0911
  • 期刊名称：Soldering & Surface Mount Technology
  • 时间：2013
  • 页码：107-116
  • 相关项目：大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
作者： Mei, Yunhui|Chen, Gang|Li, Xin|Lu, Guo-Quan|Chen, Xu|
同期刊论文项目
大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
期刊论文 14 会议论文 5
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