采用双靶反应磁控溅射方法制备了Cu含量不同的AlN/Cu纳米复合涂层。采用X射线衍射(XRD)、纳米压痕、X射线光电子能谱(XPS)等方法观察和分析了涂层的结构、力学性能以及内部化学结合状态。XRD结果表明所有涂层中的AlN均为(002)择优取向的六方纤锌矿结构,cu含量1〉4.7%原子比涂层中可以观察到Cu(111)峰的存在。纳米压痕结果表明:Cu含量的多少影响涂层的力学性能,如硬度日、弹性模量E。Cu含量为17.0%时,H=27.3GPa、E=264.9GPa,H/E=0.103;随着压入深度从80nm增加至250nm,弹性回复值从78.2%降至67.9%。XPS分析表明:对于17.0%Cu含量的涂层而言,电子结合能位于73.5,932.3和933.4eV处的峰分别对应着Al-N键、Cu-Cu键和Cu-Al键。Cu-Al键的存在说明AlN相与Cu相在两相界面处存在一定的相互化学作用。
The AlN/Cu composite coatings were deposited by reactive magnetron sputtering on substrates of Si(100) and Coming glass. The influence of the deposition conditions on the microstructures was evaluated. The coatings were characterized with X-ray diffraction, X-ray photoelectron spectroscopy, and conventional mechanical probes. The results show that the Cu-content strongly affects the mechanical properties of the hexagonal wurtzite-structured AlN/Cu gains, with (002) as the preferential growth orientation, in the coatings. For example,as the Cu content increased,the hardness and modulus of the Al-Cu-N coating changed in an increase-decrease mode, at a Cu-content of 17.0%, its hardness was found to be 27.3 GPa with a modulus of 264.9 GPa. Possible mechanisms responsible for improved mechanical properties were also tentatively discussed.